1引言...........................................................................................................1
2系統(tǒng)總體設(shè)計方案.................................................................................2
2.1方案設(shè)計.......................................................................................2
2.2工作原理.......................................................................................2
3系統(tǒng)硬件設(shè)計.........................................................................................3
3.1鉑熱電阻簡介...............................................................................4
3.2運算放大器 LM324簡介...........................................................5
3.3ADC0804芯片簡介.....................................................................6
3.4控制電路......................................................................................7
3.5顯示電路.....................................................................................10
4系統(tǒng)軟件設(shè)計........................................................................................11
4.1軟件介紹.....................................................................................11
4.2程序流程圖.................................................................................13
5元件清單...............................................................................................14
6系統(tǒng)調(diào)試與測試結(jié)果...........................................................................14
7測量結(jié)果分析.......................................................................................15
7.1結(jié)果分析.....................................................................................15
7.2誤差分析.....................................................................................16
8總結(jié)........................................................................................................19